This month, AMD will officially release the Xilon 7003 series data center processor's third generation, codenaming "Milan" (Milan). It is based on 7nm technology, Zen3 architecture, up to 64 cores, and 128 threads, supports eight channels of DDR4-3200 memory, and 128 PCIe 4.0 channels.
After that, naturally, it will be a 5nm process, Zen4 architecture, codename "Genoa" (Genoa), and the product sequence will be the fourth generation of the Xiaolon 7004 series.
But the release time may have to wait patiently; the earliest is expected to be in the second half of 2021, or even early 2022.
Core specifications of the fourth generation:
1. The number of cores is 96 at most, and the number of threads is 196 at most, which is half more than now.
Inside, there are still small Chiplet chips, each with eight cores, 12, followed by one IO chip.
2, Memory supports a new generation of DDR5, the highest frequency up to 5200MHz, the number of channels also increased by half to 12.
With two Memory per channel, the maximum number of single channels is 24. With 128GB memory, the maximum number of single channels is 3TB.
3, input and output support the new generation of PCIe 5.0, single-channel is still up to 128 channels, but dual external can provide 160.
This means that the number of channels needed for internal communication between two media has been reduced from 128 to 96; after all, the bandwidth has doubled.
4, Thermal design power consumption up to 320W, 40W more than the present, and support up to 400W(CTDP).
5. The interface is replaced with the new SP5 LGA6096 for the first time, which adds up to 2002 contacts compared with the current SP3 LGA4094.
After all, support for DDR5, PCI-E 5.0, but the exciting thing is that the SP4 name was skipped.
Intel will release the fourth generation, codenamed Sapphire Rapids, at the end of this year, which is scalable and robust in competing products. The specification is also a leap forward, but it is inferior to the fourth generation in all aspects.
10nm Enhanced Superfine manufacturing process, Golden Cove CPU architecture, MCM multi-core package, up to 4 small chips, 60 cores and 120 threads (at least initially hidden four seats), integrated up to 64GB HBM2E high-bandwidth memory, support up to 8 channels of DDR5-4800, 80 PCIe 5.0, thermal design power up to 400W, interface to the new LGA4677-X.
